Research|Optics & Power: OCP APAC Summit Takeaways

We attended the OCP APAC Summit in Taipei this week. This note outlines our top-level takeaways on optics and power.

A clear theme at the conference was scale-up networking, and whether it stays on copper or moves to optics once a domain grows past one rack. Like OFC 2026 and OCP EMEA before this one, the industry keeps landing on the same answer: copper where you can so far, but optics remains the structural future direction.

The second theme was co-packaged optics, where views on the adoption timeline diverged. Nvidia and Broadcom both assert that they have CPO in production. ASE, one of the OSATs that assemble and test CPO packages, said the ecosystem is not ready.

On the non-optics side, our takeaway is that the industry is redesigning the entire power path end to end, from grid to chip. At the facility level, data center build-out is shifting from component stacking toward vertically integrated, modular designs that scale to GW-class deployments. In power architecture, the industry is converging on 800VDC as the next standard, with solid-state transformers emerging as the endgame for cutting conversion loss as rack power heads past the MW level. At the package level, power delivery is moving underneath the chip via vertical power delivery, reshaping component demand and driving higher-capacitance MLCC, smaller form-factor SPS, and a materials transition in inductors along the way.

We expand on these points below, then turn to our power takeaways, and close with the more technical optics sections.

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